Invention Grant
- Patent Title: Memory architectures having dense layouts
- Patent Title (中): 具有密集布局的内存架构
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Application No.: US14499401Application Date: 2014-09-29
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Publication No.: US09257522B2Publication Date: 2016-02-09
- Inventor: Hau-Yan Lu , Shih-Hsien Chen , Chun-Yao Ko , Felix Ying-Kit Tsui
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; G11C11/56 ; G11C8/14 ; G11C11/408 ; G11C11/4097

Abstract:
Some embodiments relate to a memory cell to store one or more bits of data. The memory cell includes a capacitor including first and second capacitor plates which are separated from one another by a dielectric. The first capacitor plate corresponds to a doped region disposed in a semiconductor substrate, and the second capacitor plate is a polysilicon or metal layer arranged over the doped region. The memory cell also includes a transistor laterally spaced apart from the capacitor and including a gate electrode arranged between first and second source/drain regions. An interconnect structure is disposed over the semiconductor substrate and couples the gate electrode of the transistor to the second capacitor plate.
Public/Granted literature
- US20150016180A1 MEMORY ARCHITECTURES HAVING DENSE LAYOUTS Public/Granted day:2015-01-15
Information query
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