Invention Grant
- Patent Title: Headphone set
- Patent Title (中): 耳机套
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Application No.: US14645200Application Date: 2015-03-11
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Publication No.: US09258636B2Publication Date: 2016-02-09
- Inventor: Masahiro Nakano , Mikiyasu Ishikura , Yusaku Shimaoka , Hitoshi Nakagawa , Tetsuya Kaneshiro
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2013-267111 20131225
- Main IPC: H04R1/10
- IPC: H04R1/10

Abstract:
In a conventional headphone set, there is a possibility that a headband cannot be put in a suitable position when an ear pad is snugly mounted on an ear. A headphone set of this disclosure includes speaker units which output a sound. The headphone set also includes: speaker housings which are brought into contact with a user; connecting portions which are connected to the speaker housings in a state where the speaker housings are movable in a forward and rearward direction of the user; and a headband which has connecting portions on end portions thereof and is mounted on a head of the user in directions toward a crown of the head of the user. Due to such a constitution, the headphone set can be used in a more stable manner.
Public/Granted literature
- US20150189422A1 HEADPHONE SET Public/Granted day:2015-07-02
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