发明授权
- 专利标题： Wiring circuit board and manufacturing method thereof
- 专利标题（中）： 接线电路板及其制造方法
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申请号： US13381198申请日： 2010-09-29
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公开(公告)号： US09258903B2公开(公告)日： 2016-02-09
- 发明人: Masaichi Inaba , Masayuki Iwase
- 申请人： Masaichi Inaba , Masayuki Iwase
- 申请人地址： JP Tokyo-To
- 专利权人： NIPPON MEXTRON, LTD.
- 当前专利权人： NIPPON MEXTRON, LTD.
- 当前专利权人地址： JP Tokyo-To
- 代理机构： Jacobson Holman, PLLC.
- 优先权： JP2010-022430 20100203
- 国际申请： PCT/JP2010/066953 WO 20100929
- 国际公布： WO2011/096110 WO 20110811
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K3/24 ; H05K3/34
摘要：
It is an object to form a conductive intermediate layer having a function of maximally preventing a solder leaching phenomenon with a low environment load and with good productivity.There are provided an insulative base material 2, a wiring circuit pattern 3 formed on at least one surface of the insulative base material 2, an electronic part mounting land 31 which is formed as part of the wiring circuit pattern 3 and on which an electronic part 7 is to be mounted, and a conductive intermediate layer 5 made of a sintered conductive ink film on the electronic part mounting land 31.
公开/授权文献
- US20120103678A1 WIRING CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 公开/授权日：2012-05-03
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