Invention Grant
US09263186B2 DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor
有权
DC / AC双功能供电网络（PDN）去耦电容器
- Patent Title: DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor
- Patent Title (中): DC / AC双功能供电网络（PDN）去耦电容器
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Application No.: US13785502Application Date: 2013-03-05
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Publication No.: US09263186B2Publication Date: 2016-02-16
- Inventor: Yue Li , Xiaoming Chen , Zhongping Bao , Charles D. Paynter , Xiaonan Zhang , Ryan D. Lane
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01G2/06 ; H01L23/50 ; H01L23/64 ; H01L23/00 ; H01G4/38 ; H01G4/40 ; H01L23/498
Abstract:
Some implementations provide a semiconductor device that includes a first substrate, a die coupled to the first substrate, and a set of solder balls coupled to the first substrate. The set of solder balls is configured to provide an electrical connection between the die and a second substrate. The semiconductor device also includes at least one decoupling capacitor coupled to the die through the first substrate. The at least one decoupling capacitor is configured to provide an electrical connection between the die and the second substrate. The at least one decoupling capacitor is coupled to the first substrate such that the at least one decoupling capacitor is positioned between the first substrate and the second substrate. In some implementations, the second substrate is a printed circuit board (PCB). In some implementations, the first substrate is a first package substrate, and the second substrate is a second package substrate.
Public/Granted literature
- US20140252544A1 DC/ AC DUAL FUNCTION POWER DELIVERY NETWORK (PDN) DECOUPLING CAPACITOR Public/Granted day:2014-09-11
Information query
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