Invention Grant
- Patent Title: Carrier with hollow chamber and support structure therein
- Patent Title (中): 其中具有中空室和支撑结构的载体
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Application No.: US14098580Application Date: 2013-12-06
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Publication No.: US09263357B2Publication Date: 2016-02-16
- Inventor: Steffen Bieselt
- Applicant: Infineon Technologies Dresden GmbH
- Applicant Address: DE Dresden
- Assignee: INFINEON TECHNOLOGIES DRESDEN GMBH
- Current Assignee: INFINEON TECHNOLOGIES DRESDEN GMBH
- Current Assignee Address: DE Dresden
- Main IPC: H01L23/053
- IPC: H01L23/053 ; H01L21/02 ; H01L21/48 ; H01L21/762 ; H05K1/02

Abstract:
According to various embodiments, a carrier may include: a hollow chamber spaced apart from a surface of the carrier; and at least one support structure within the hollow chamber connecting a first region of the carrier disposed over the hollow chamber with a second region of the carrier disposed below the hollow chamber, wherein at least a part of a surface of the at least one support structure is spaced apart from an inner surface of the hollow chamber, and wherein the at least one support structure includes an electrically insulating material.
Public/Granted literature
- US20150162254A1 CARRIER AND A METHOD FOR PROCESSING A CARRIER Public/Granted day:2015-06-11
Information query
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