- 专利标题: Techniques for forming non-planar germanium quantum well devices
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申请号: US14069880申请日: 2013-11-01
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公开(公告)号: US09263557B2公开(公告)日: 2016-02-16
- 发明人: Ravi Pillarisetty , Jack T. Kavalieros , Willy Rachmady , Uday Shah , Benjamin Chu-Kung , Marko Radosavljevic , Niloy Mukherjee , Gilbert Dewey , Been-Yih Jin , Robert S. Chau
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Finch & Maloney PLLC
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; B82Y10/00 ; H01L29/267 ; H01L29/775 ; H01L29/778 ; H01L21/76 ; H01L29/78 ; H01L29/10 ; H01L29/51
摘要:
Techniques are disclosed for forming a non-planar germanium quantum well structure. In particular, the quantum well structure can be implemented with group IV or III-V semiconductor materials and includes a germanium fin structure. In one example case, a non-planar quantum well device is provided, which includes a quantum well structure having a substrate (e.g. SiGe or GaAs buffer on silicon), a IV or III-V material barrier layer (e.g., SiGe or GaAs or AlGaAs), a doping layer (e.g., delta/modulation doped), and an undoped germanium quantum well layer. An undoped germanium fin structure is formed in the quantum well structure, and a top barrier layer deposited over the fin structure. A gate metal can be deposited across the fin structure. Drain/source regions can be formed at respective ends of the fin structure.
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