发明授权
US09263596B2 Semiconductor device and method of manufacturing the same 有权
半导体装置及其制造方法

  • 专利标题: Semiconductor device and method of manufacturing the same
  • 专利标题(中): 半导体装置及其制造方法
  • 申请号: US14495558
    申请日: 2014-09-24
  • 公开(公告)号: US09263596B2
    公开(公告)日: 2016-02-16
  • 发明人: Deung Kak Yoo
  • 申请人: SK hynix Inc.
  • 申请人地址: KR Gyeonggi-do
  • 专利权人: SK Hynix Inc.
  • 当前专利权人: SK Hynix Inc.
  • 当前专利权人地址: KR Gyeonggi-do
  • 代理机构: IP & T Group LLP
  • 优先权: KR10-2014-0057247 20140513
  • 主分类号: H01L29/792
  • IPC分类号: H01L29/792 H01L27/115
Semiconductor device and method of manufacturing the same
摘要:
A semiconductor device includes a channel layer including a sidewall having protrusions and depressions alternating with each other in a direction in which the channel layer extends, a tunnel insulating layer surrounding the channel layer, first charge storage patterns surrounding the tunnel insulating layer formed in the depressions, blocking insulation patterns surrounding the first charge patterns formed in the depressions, wherein the blocking insulating patterns include connecting portions coupled to the tunnel insulating layer, and second charge storage patterns surrounding the tunnel insulating layer formed in the protrusions.
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信息查询
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L29/00 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件(H01L31/00至H01L47/00,H01L51/05优先;除半导体或其电极之外的零部件入H01L23/00;由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00)
H01L29/66 .按半导体器件的类型区分的
H01L29/68 ..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的(H01L29/96优先)
H01L29/76 ...单极器件
H01L29/772 ....场效应晶体管
H01L29/78 .....由绝缘栅产生场效应的
H01L29/792 ......带有电荷捕获栅绝缘体,例如MNOS存储晶体管
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