A package substrate includes a core substrate, a first buildup layer and a second buildup layer. The first buildup layer includes an uppermost interlayer, an upper inner interlayer, an uppermost conductive layer including first pads and second pads, an upper first conductive layer, an upper second conductive layer, vias formed through the uppermost interlayer and connecting the upper first conductive layer and the second pads, and skip vias formed through the uppermost and upper inner interlayers and connecting the uppermost and upper second conductive layers. The second buildup layer includes a lowermost interlayer, a lower inner interlayer, a lowermost conductive layer including third pads, a lower first conductive layer, a lower second conductive layer, vias formed through the lowermost interlayer and connecting the lower first conductive layer and third pads, and skip vias formed through the lowermost and lower inner interlayers and connecting the lowermost and lower second conductive layers.