A system to monitor the temperature of power electronic devices in a motor drive includes a base plate defining a planar surface on which the electronic devices and/or circuit boards within the motor drive may be mounted. The power electronic devices are mounted to the base plate through the direct bond copper (DBC). A circuit board is mounted to the base plate which includes a temperature sensor mounted on the circuit board proximate to the power electronic devices. The temperature sensor generates a digital signal corresponding to the temperature measured by the sensor. A copper pad is included between each layer of the circuit board and between the first layer of the circuit board and the sensor. The circuit board also includes vias extending through each layer of the board. The copper pads and vias establish a thermally conductive path between the temperature sensor and the base plate.