Invention Grant
- Patent Title: Aluminum copper clad material
- Patent Title (中): 铝铜包材
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Application No.: US13701677Application Date: 2011-06-02
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Publication No.: US09266188B2Publication Date: 2016-02-23
- Inventor: Yoshimitsu Oda , Masaaki Ishio , Akio Hashimoto , Kenji Ikeuchi
- Applicant: Yoshimitsu Oda , Masaaki Ishio , Akio Hashimoto , Kenji Ikeuchi
- Applicant Address: JP Osaka
- Assignee: NEOMAX MATERIALS CO., LTD.
- Current Assignee: NEOMAX MATERIALS CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Keating & Bennett, LLP
- Priority: JP2010-130699 20100608
- International Application: PCT/JP2011/062651 WO 20110602
- International Announcement: WO2011/155379 WO 20111215
- Main IPC: B32B15/20
- IPC: B32B15/20 ; B23K20/02 ; B32B15/01

Abstract:
An aluminum copper clad material has excellent bonding strength and includes an aluminum layer and a copper layer that are bonded without a nickel layer interposed therebetween. The aluminum layer and the copper layer are diffusion-bonded via an Al—Cu intermetallic compound layer. The copper layer satisfies Dcs≦0.5×Dcc, where Dcc represents the average crystal grain size of crystal grains in a central portion in the thickness direction of the copper layer, and Dcs represents the average crystal grain size of an interface adjacent portion C2 in the copper layer that is about 0.5 μm apart from the interface between the copper layer and the intermetallic compound layer. The intermetallic compound layer has an average thickness of about 0.5 μm to about 10 μm.
Public/Granted literature
- US20130071686A1 ALUMINUM COPPER CLAD MATERIAL Public/Granted day:2013-03-21
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