Invention Grant
- Patent Title: Heat exchanger and an air conditioning system having the same
- Patent Title (中): 热交换器和具有该热交换器的空调系统
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Application No.: US13756926Application Date: 2013-02-01
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Publication No.: US09267716B2Publication Date: 2016-02-23
- Inventor: Chiwoo Song , Yongcheol Sa
- Applicant: LG Electronics Inc.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2012-0011309 20120203
- Main IPC: F25B49/02
- IPC: F25B49/02 ; F25B30/02 ; F24F1/14 ; F25B39/00 ; F25B41/04 ; F28F9/26 ; F28D1/053

Abstract:
A heat exchanger included in an air conditioner includes a first header pipe to have a refrigerant, compressed by a compressor, to flow therein and a first heat exchange unit coupled to the first header pipe to receive the refrigerant flowing in the first header, a second header pipe to have the refrigerant to flow therein and a second heat exchange unit coupled to the second header pipe to receive the refrigerant flowing in the second header pipe in the air cooling operation. A bypass pipe couples the first heat exchange unit with the second header pipe and a bypass valve controls a flow of the refrigerant through the bypass pipe. A controller controls the bypass valve such that the refrigerant is allowed to flow from the first heat exchange unit to the second header pipe in the air cooling operation.
Public/Granted literature
- US20130219944A1 HEAT EXCHANGER Public/Granted day:2013-08-29
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