Invention Grant
- Patent Title: Debond interconnect structures
- Patent Title (中): Debond互连结构
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Application No.: US14132157Application Date: 2013-12-18
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Publication No.: US09269686B2Publication Date: 2016-02-23
- Inventor: Qing Ma , Jun He , Patrick Morrow , Paul B. Fischer , Sridhar Balakrishnan , Satish Radhakrishnan , Tatyana T. Adryushchenko , Guanghai Xu
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H01L23/00 ; B23K1/00 ; H05K3/40
Abstract:
The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.
Public/Granted literature
- US20140106560A1 DEBOND INTERCONNECT STRUCTURES Public/Granted day:2014-04-17
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