Invention Grant
US09269891B2 Process integration of a single chip three axis magnetic field sensor 有权
单芯片三轴磁场传感器的工艺集成

Process integration of a single chip three axis magnetic field sensor
Abstract:
A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane.
Information query
Patent Agency Ranking
0/0