Invention Grant
- Patent Title: Process integration of a single chip three axis magnetic field sensor
- Patent Title (中): 单芯片三轴磁场传感器的工艺集成
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Application No.: US13972637Application Date: 2013-08-21
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Publication No.: US09269891B2Publication Date: 2016-02-23
- Inventor: Renu Whig , Philip Mather , Kenneth Smith , Sanjeev Aggarwal , Jon Slaughter , Nicholas Rizzo
- Applicant: EverSpin Technologies, Inc.
- Applicant Address: US AZ Chandler
- Assignee: EVERSPIN TECHNOLOGIES, INC.
- Current Assignee: EVERSPIN TECHNOLOGIES, INC.
- Current Assignee Address: US AZ Chandler
- Agency: Bookoff McAndrews, PLLC
- Main IPC: H01L43/12
- IPC: H01L43/12 ; B82Y25/00 ; G01R33/00 ; G01R33/09 ; H01L27/22

Abstract:
A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane.
Public/Granted literature
- US20140138346A1 PROCESS INTEGRATION OF A SINGLE CHIP THREE AXIS MAGNETIC FIELD SENSOR Public/Granted day:2014-05-22
Information query
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