发明授权
- 专利标题: Flexible electronic circuit enclosure assembly
- 专利标题(中): 灵活的电子电路外壳组件
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申请号: US14000763申请日: 2012-03-09
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公开(公告)号: US09271430B2公开(公告)日: 2016-02-23
- 发明人: Chris R. Snider
- 申请人: Chris R. Snider
- 申请人地址: US MI Troy
- 专利权人: Delphi Technologies, Inc.
- 当前专利权人: Delphi Technologies, Inc.
- 当前专利权人地址: US MI Troy
- 代理商 Lawrence D. Hazelton
- 国际申请: PCT/US2012/028416 WO 20120309
- 国际公布: WO2012/125436 WO 20120920
- 主分类号: H05K9/00
- IPC分类号: H05K9/00 ; H05K13/00
摘要:
A flexible enclosure assembly for an electronic device for vehicular application is virtually “fastenerless” and includes a preform blank of conductive sheet material such as wire screen mesh or the like which defines upper, lower and a plurality of side wall portions flexibly interconnected by living hinges. A framework of resilient elastomeric material is insert molded to the preform blank to provide three-dimensional case details to accept one or more electronic devices such as circuit boards required for electrical control and display of vehicle based systems. The conductive sheet material is preferably a wire mesh which provides shielding from electrical anomalies and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. Major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment.
公开/授权文献
- US20130333941A1 FLEXIBLE ELECTRONIC CIRCUIT ENCLOSURE ASSEMBLY 公开/授权日:2013-12-19
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