Invention Grant
- Patent Title: Grounding of a shield within an implantable medical lead
- Patent Title (中): 在植入式医疗导线内接地护罩
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Application No.: US14456809Application Date: 2014-08-11
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Publication No.: US09272136B2Publication Date: 2016-03-01
- Inventor: James M. Olsen , Michael Robert Klardie , Richard T. Stone , Chad Q. Cai , Spencer M. Bondhus , Mark J. Conroy , Timothy R. Abraham
- Applicant: MEDTRONIC, INC.
- Applicant Address: US MN Minneapolis
- Assignee: MEDTRONIC, INC.
- Current Assignee: MEDTRONIC, INC.
- Current Assignee Address: US MN Minneapolis
- Agency: Withers & Keys, LLC
- Main IPC: A61N1/00
- IPC: A61N1/00 ; A61N1/08 ; A61N1/05 ; A61N1/37 ; A61N1/375 ; A61M25/01 ; A61B19/00

Abstract:
Implantable medical leads include a shield that is guarded at a termination by having a first portion and a second portion of the shield, where the first portion is between a termination of the shield at the second portion and an inner insulation layer that surrounds the filars. The first portion may reduce the coupling of RF energy from the termination of the shield at the second portion to the filars. The first and second portions may be part of a continuous shield, where the first and second portions are separated by an inversion of the shield. The first and second portions may instead be separate pieces. The first portion may be noninverted and reside between the termination at the second portion and the inner layers, or the first portion may be inverted to create first and second sub-portions. The shield termination at the second portion is between the first and second sub-portions.
Public/Granted literature
- US20140350654A1 GROUNDING OF A SHIELD WITHIN AN IMPLANTABLE MEDICAL LEAD Public/Granted day:2014-11-27
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