发明授权
US09272462B2 Minute convexo-concave pattern forming method and forming device, and transfer substrate producing method and transfer substrate
有权
分钟凸凹图案形成方法和成型装置,以及转印基板的制造方法和转印基板
- 专利标题: Minute convexo-concave pattern forming method and forming device, and transfer substrate producing method and transfer substrate
- 专利标题(中): 分钟凸凹图案形成方法和成型装置,以及转印基板的制造方法和转印基板
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申请号: US13636253申请日: 2011-03-24
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公开(公告)号: US09272462B2公开(公告)日: 2016-03-01
- 发明人: Shinichiro Okada , Shotaro Ogawa
- 申请人: Shinichiro Okada , Shotaro Ogawa
- 申请人地址: JP Tokyo
- 专利权人: FUJIFILM Corporation
- 当前专利权人: FUJIFILM Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Young & Thompson
- 优先权: JP2010-075495 20100329
- 国际申请: PCT/JP2011/057178 WO 20110324
- 国际公布: WO2011/122439 WO 20111006
- 主分类号: B29C33/42
- IPC分类号: B29C33/42 ; H01L21/683 ; B29C59/00 ; B29C33/44 ; B82Y10/00 ; B82Y40/00 ; G03F7/00
摘要:
A minute convexo-concave pattern forming method includes: transferring a minute convexo-concave pattern of a mold to a resist layer of a transfer substrate where a resist layer is formed on a substrate and curing the transferred minute convexo-concave pattern; and after curing the transferred minute convexo-concave pattern, peeling the transfer substrate and the mold, the peeling step including: pressurizing a substrate back surface side of the transfer substrate with a peripheral part of the transfer substrate being fixed to bend the transfer substrate in a curved shape and starting peeling of the transfer substrate and the mold with a bending of the transfer substrate; and peeling a part of the minute convexo-concave pattern of the transfer substrate not peeled in the first peeling step by gradually decreasing a pressure for a pressurization so as to undo the bending of the transfer substrate.
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