Invention Grant
US09273235B2 Bonding material comprising coated silver nanoparticles and bonded object produced using same
有权
包含涂覆的银纳米颗粒和使用其制备的粘合物的粘合材料
- Patent Title: Bonding material comprising coated silver nanoparticles and bonded object produced using same
- Patent Title (中): 包含涂覆的银纳米颗粒和使用其制备的粘合物的粘合材料
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Application No.: US14124509Application Date: 2011-06-10
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Publication No.: US09273235B2Publication Date: 2016-03-01
- Inventor: Satoru Kurita , Takashi Hinotsu , Shinya Sasaki
- Applicant: Satoru Kurita , Takashi Hinotsu , Shinya Sasaki
- Applicant Address: JP Tokyo
- Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
- Current Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- International Application: PCT/JP2011/063421 WO 20110610
- International Announcement: WO2012/169076 WO 20121213
- Main IPC: B32B5/16
- IPC: B32B5/16 ; B32B25/02 ; C09J11/06 ; C22C5/06 ; H01L23/00 ; H05K1/09 ; B22F1/00

Abstract:
A bonding material using silver nanoparticles considerably changes in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. A bonding material which uses silver nanoparticles, meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface is provided. The bonding material includes silver nanoparticles which have at least an average primary particle diameter of 1 nm to 200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier composed of an organic substance, and has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa·s or lower and a thixotropic ratio (measured at a shear rate of 3.1 [1/s]/measured at a shear rate of 15.7 [1/s]) of 4 or lower.
Public/Granted literature
- US20140113109A1 BONDING MATERIAL AND BONDED OBJECT PRODUCED USING SAME Public/Granted day:2014-04-24
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