Invention Grant
- Patent Title: Photonic integration platform
- Patent Title (中): 光子集成平台
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Application No.: US13935277Application Date: 2013-07-03
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Publication No.: US09274275B2Publication Date: 2016-03-01
- Inventor: Mark Webster , Ravi Sekhar Tummidi
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Patterson & Sheridan, LLP
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/122 ; G02B6/30 ; G02B6/132 ; G02B6/10 ; G02B6/43

Abstract:
A SOI device may include a waveguide adapter that couples light between an external light source—e.g., a fiber optic cable or laser—and a silicon waveguide on the silicon surface layer of the SOI device. In one embodiment, the waveguide adapter is embedded into the insulator layer. Doing so may enable the waveguide adapter to be formed before the surface layer components are added onto the SOI device. Accordingly, fabrication techniques that use high-temperatures may be used without harming other components in the SOI device—e.g., the waveguide adapter is formed before heat-sensitive components are added to the silicon surface layer.
Public/Granted literature
- US20150010266A1 PHOTONIC INTEGRATION PLATFORM Public/Granted day:2015-01-08
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