发明授权
- 专利标题: Semiconductor integrated circuit with stack package structure
- 专利标题(中): 半导体集成电路采用堆叠封装结构
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申请号: US13719096申请日: 2012-12-18
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公开(公告)号: US09275703B2公开(公告)日: 2016-03-01
- 发明人: Dong-Uk Lee , Young-Ju Kim , Keun-Soo Song
- 申请人: SK hynix Inc.
- 申请人地址: KR Gyeonggi-do
- 专利权人: SK Hynix Inc.
- 当前专利权人: SK Hynix Inc.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: IP & T Group LLP
- 优先权: KR10-2012-0071270 20120629
- 主分类号: G11C7/00
- IPC分类号: G11C7/00 ; G11C7/22 ; G11C8/18 ; G11C7/10
摘要:
A semiconductor integrated circuit including first semiconductor chip and second semiconductor chip that are vertically stacked, wherein the first semiconductor chip includes a first column data driving circuit configured to transmit internal data to the second semiconductor chip in a DDR (double data rate) scheme based on an internal strobe signal, and a first column strobe signal driving circuit configured to generate first column strobe signals that are source-synchronized with first column data transmitted to the second semiconductor chip by the first column data driving circuit, based on the internal strobe signal, and transmit the first column strobe signals to the second semiconductor chip.
公开/授权文献
- US20140003168A1 SEMICONDUCTOR INTEGRATED CIRCUIT 公开/授权日:2014-01-02
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