Invention Grant
- Patent Title: Method of detaching a layer
- Patent Title (中): 分离层的方法
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Application No.: US14426509Application Date: 2013-04-10
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Publication No.: US09275893B2Publication Date: 2016-03-01
- Inventor: Alexandre Barthelemy
- Applicant: Soitec
- Applicant Address: FR Bernin
- Assignee: Soitec
- Current Assignee: Soitec
- Current Assignee Address: FR Bernin
- Agency: TraskBritt
- Priority: FR1202437 20120910
- International Application: PCT/IB2013/000653 WO 20130410
- International Announcement: WO2014/037769 WO 20140313
- Main IPC: H01L21/762
- IPC: H01L21/762

Abstract:
The present disclosure concerns a method of detaching a layer to be detached from a donor substrate, comprising the following steps: a) assembling the donor substrate and a porous substrate, b) application of a treatment of chemical modification of the crystallites, the chemical modification being adapted to generate a variation of the volume of the crystallites, the volume variation generates deformation in compression or in tension of the porous substrate, the deformation in compression or in tension generates a stress in tension or in compression in the donor substrate, which causes fracture in a fracture plane, the fracture plane delimiting the layer to be detached, the stress leading to the detachment of the layer to be detached from the donor substrate.
Public/Granted literature
- US20150243551A1 METHOD OF DETACHING A LAYER Public/Granted day:2015-08-27
Information query
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