Invention Grant
- Patent Title: Low profile high temperature double sided flip chip power packaging
- Patent Title (中): 低调高温双面倒装芯片电源封装
-
Application No.: US14016728Application Date: 2013-09-03
-
Publication No.: US09275938B1Publication Date: 2016-03-01
- Inventor: Brice McPherson , Brandon Passmore , Adam Barkley , Robert Shaw
- Applicant: Arkansas Power Electronics International, Inc.
- Applicant Address: US AK Fayetteville
- Assignee: Cree Fayetteville, Inc.
- Current Assignee: Cree Fayetteville, Inc.
- Current Assignee Address: US AK Fayetteville
- Agency: Baker & Hostetler LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/495
Abstract:
A wire bondless, double flip chipped discrete power package including a base plate for structural support, heat spreading, and thermal connection, power substrate for electrical interconnection and isolation, lead frames for external connections, an upper substrate for topside electrical interconnection, and injection molded housing for mounting, isolation, and protection.
Information query
IPC分类:
