发明授权
- 专利标题： Semiconductor device and semiconductor package having a plurality of differential signal balls
- 专利标题（中）： 具有多个差分信号球的半导体器件和半导体封装
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申请号： US14190775申请日： 2014-02-26
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公开(公告)号： US09275947B2公开(公告)日： 2016-03-01
- 发明人: Isao Ozawa , Isao Maeda , Yasuo Kudo , Koichi Nagai , Katsuya Murakami , Akira Tanimoto
- 申请人： KABUSHIKI KAISHA TOSHIBA
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Patterson & Sheridan, LLP
- 优先权： JP2013-240238 20131120
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/50 ; H01L23/498 ; H01L25/065 ; H01L23/367 ; H01L23/31 ; H01L23/66 ; H01L25/18
摘要：
A semiconductor device includes a substrate, a sealing portion, a controller, a semiconductor chip, and a plurality of differential signal balls. The substrate has a first surface and a second surface positioned on a side opposite to the first surface. The sealing portion is formed on the first surface of the substrate. The controller is covered with the sealing portion. The semiconductor chip is electrically connected to the controller, and is covered with the sealing portion. The plurality of differential signal balls are formed on the second surface of the substrate. At least some of the plurality of differential signal balls are arranged substantially parallel to one side of the substrate.
公开/授权文献
- US20150137363A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE 公开/授权日：2015-05-21
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