发明授权
US09276113B2 Structure and method to make strained FinFET with improved junction capacitance and low leakage
有权
具有改善的结电容和低泄漏的应变FinFET的结构和方法
- 专利标题: Structure and method to make strained FinFET with improved junction capacitance and low leakage
- 专利标题(中): 具有改善的结电容和低泄漏的应变FinFET的结构和方法
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申请号: US14202525申请日: 2014-03-10
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公开(公告)号: US09276113B2公开(公告)日: 2016-03-01
- 发明人: Kangguo Cheng , Bruce B. Doris , Ali Khakifirooz , Darsen D. Lu , Alexander Reznicek , Kern Rim
- 申请人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址: US NY Armonk
- 专利权人: International Business Corporation
- 当前专利权人: International Business Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Tutunjian & Bitetto, P.C.
- 代理商 Vazken Alexanian
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L21/8234 ; H01L29/78 ; H01L29/66 ; H01L21/306 ; H01L21/02 ; H01L29/165
摘要:
A method of forming a semiconductor device that includes forming a gate structure on a fin structure and etching the source and drain region portions of the fin structure to provide a recessed surface. A first semiconductor layer is formed on the recessed surface of the fin structure that is doped to a first conductivity type. A leakage barrier layer is formed on the first semiconductor layer. A second semiconductor layer is formed on the leakage barrier layer. The second semiconductor layer is doped to a second conductivity type.
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