Invention Grant
- Patent Title: Refrigeration apparatus
- Patent Title (中): 制冷装置
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Application No.: US13643134Application Date: 2011-04-28
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Publication No.: US09276516B2Publication Date: 2016-03-01
- Inventor: Yoshiyuki Harada , Toshiyuki Maeda
- Applicant: Yoshiyuki Harada , Toshiyuki Maeda
- Applicant Address: JP Osaka
- Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2010-106148 20100506
- International Application: PCT/JP2011/002523 WO 20110428
- International Announcement: WO2011/138864 WO 20111110
- Main IPC: H02M1/32
- IPC: H02M1/32 ; H02P27/08 ; F25B31/00 ; H02P29/00 ; H02M1/44 ; F25B49/02

Abstract:
A refrigeration apparatus includes a refrigerant circuit with a compressor, a power module, a refrigerant cooler in contact with the power module, and an IPM motor which drives the compressor. A refrigerant in the refrigerant circuit flows through the refrigerant cooler, and cooling of the power module is performed by dissipating heat to the refrigerant flowing in the refrigerant cooler. A controller in the refrigeration apparatus outputs a driving signal to a drive circuit to reduce the number of switching operations of switching elements by performing overmodulation control such that there exists a carrier cycle in which no switching is performed.
Public/Granted literature
- US20130036759A1 REFRIGERATION APPARATUS Public/Granted day:2013-02-14
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