Invention Grant
- Patent Title: Flexible printed circuit board and method for manufacturing same
- Patent Title (中): 柔性印刷电路板及其制造方法
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Application No.: US14586986Application Date: 2014-12-31
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Publication No.: US09277640B2Publication Date: 2016-03-01
- Inventor: Ming-Jaan Ho , Xian-Qin Hu , Fu-Yun Shen , Yi-Qiang Zhuang
- Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. , Zhen Ding Technology Co., Ltd.
- Applicant Address: CN Shenzhen TW Tayuan, Taoyuan
- Assignee: FuKui Precison Component (Shenzhen) Co., Ltd.,Zhen Ding Technology Co., Ltd.
- Current Assignee: FuKui Precison Component (Shenzhen) Co., Ltd.,Zhen Ding Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen TW Tayuan, Taoyuan
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201310747914 20131231
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K3/00 ; H05K1/03

Abstract:
A flexible printed circuit board includes a flexible printed circuit unit and an electromagnetic shielding structure. The flexible printed circuit unit includes a base layer and a first circuit layer formed on a surface of the base layer. The electromagnetic shielding structure includes a first insulating layer and a copper layer. The first insulating layer is adhered on a surface of the first circuit layer away from the base layer. At least one blind hole is defined in the electromagnetic shielding structure. The copper layer is electrically connected to the first circuit layer by a plating structure filled in the blind hole.
Public/Granted literature
- US20150189738A1 FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME Public/Granted day:2015-07-02
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