Invention Grant
- Patent Title: Method of bonding and debonding substrate
- Patent Title (中): 粘合和剥离基材的方法
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Application No.: US14167350Application Date: 2014-01-29
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Publication No.: US09278512B2Publication Date: 2016-03-08
- Inventor: Shuo-Yang Sun , Wan-Chen Huang , Wei-Ting Lin , Chun-Cheng Cheng
- Applicant: AU Optronics Corporation
- Applicant Address: TW Hsin-Chu
- Assignee: AU OPTRONICS CORPORATION
- Current Assignee: AU OPTRONICS CORPORATION
- Current Assignee Address: TW Hsin-Chu
- Agency: WPAT, PC
- Agent Justin King
- Priority: TW102134577A 20130925
- Main IPC: B29C65/52
- IPC: B29C65/52 ; B32B37/12 ; B32B37/26 ; B32B38/04 ; B32B38/10 ; B32B43/00 ; H01L21/683 ; B32B38/00
Abstract:
A substrate bonding and debonding method includes the steps of: providing a substrate; forming a first silicone glue layer on a peel-off region of the substrate and a second silicone glue layer on a peripheral region of the substrate, in which the first and second silicone glue layers contain the same silicone main agent and silicone curing agent in a different ratio; adhering an opposite substrate to the first and second silicone glue layers; curing the first and second silicone glue layers to bond the substrate to the opposite substrate; and separating a portion of the substrate from the opposite substrate.
Public/Granted literature
- US20150083312A1 METHOD OF BONDING AND DEBONDING SUBSTRATE Public/Granted day:2015-03-26
Information query
