Invention Grant
- Patent Title: LED package mount
- Patent Title (中): LED封装
-
Application No.: US12901034Application Date: 2010-10-08
-
Publication No.: US09279543B2Publication Date: 2016-03-08
- Inventor: James Michael Lay , Long Larry Le , Paul Kenneth Pickard , Antony Paul van de Ven , James Christopher Wellborn
- Applicant: James Michael Lay , Long Larry Le , Paul Kenneth Pickard , Antony Paul van de Ven , James Christopher Wellborn
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Moore & Van Allen PLLC
- Agent Dennis J. Williamson
- Main IPC: F21V29/00
- IPC: F21V29/00 ; H05K13/00 ; F21K99/00 ; F21V19/00 ; F21V29/74 ; F21V29/83 ; F21Y101/02 ; F21V29/85 ; F21V29/89
Abstract:
A light emitting diode package mounting apparatus comprises a heatsink defining a surface comprising one of a male or female connector. An LED package has a base where a portion of the base defines the other of the female or male connector. The connectors engage one another such that a force is exerted on the base that presses the LED package against the surface. To assemble the LED package in the heat sink, the LED package is located on the surface. The LED package and heatsink are moved relative to one another such that the male connector is inserted into the female connector.
Public/Granted literature
- US20120087137A1 LED PACKAGE MOUNT Public/Granted day:2012-04-12
Information query
