Invention Grant
- Patent Title: Optical interconnection for stacked integrated circuit
- Patent Title (中): 堆叠集成电路的光互连
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Application No.: US14248759Application Date: 2014-04-09
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Publication No.: US09279937B2Publication Date: 2016-03-08
- Inventor: Young-geun Roh , Chang-won Lee , Un-jeong Kim , Jin-eun Kim , Yeon-sang Park , Jae-soong Lee , Sang-mo Cheon
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2013-0071943 20130621
- Main IPC: G02B26/08
- IPC: G02B26/08 ; G02B6/122

Abstract:
An optical interconnection for a stacked integrated circuit, is provided. The optical interconnection includes: an optical transmission unit disposed in a first layer and an optical receiving unit disposed in a second layer, different from the first layer, and spaced apart from the optical transmission unit by a predetermined gap. The optical transmission unit includes a first optical antenna that outputs light; the optical receiving unit includes a second optical antenna which receives light transmitted from the optical transmission unit. At least one of the first and second optical antennas includes a plurality of nanostructures configured to transmit or receive an optical signal.
Public/Granted literature
- US20140376856A1 OPTICAL INTERCONNECTION FOR STACKED INTEGRATED CIRCUIT Public/Granted day:2014-12-25
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