Invention Grant
- Patent Title: Interchangeable mounting platform
- Patent Title (中): 可互换安装平台
-
Application No.: US14463558Application Date: 2014-08-19
-
Publication No.: US09280038B1Publication Date: 2016-03-08
- Inventor: Paul Pan , Xifeng Zhao , Tao Zhao
- Applicant: SZ DJI TECHNOLOGY Co., Ltd
- Applicant Address: CN Shenzhen
- Assignee: SZ DJI TECHNOLOGY CO., LTD.
- Current Assignee: SZ DJI TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Wilson Sonsini Goodrich & Rosati
- Main IPC: G03B17/56
- IPC: G03B17/56

Abstract:
A platform for interchangeably mounting a payload to a base support is provided. In one aspect, the platform comprises: a support assembly configured to be releasably coupled to a payload via a first coupling and configured to control a spatial disposition of the payload; and a mounting assembly configured to be releasably coupled via a second coupling to a plurality of types of base supports selected from at least two of the following: an aerial vehicle, a handheld support, or a base adapter mounted onto a movable object.
Public/Granted literature
- US20160083110A1 INTERCHANGEABLE MOUNTING PLATFORM Public/Granted day:2016-03-24
Information query