Invention Grant
- Patent Title: Variable radius dual magnetron
- Patent Title (中): 可变半径双磁控管
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Application No.: US13777010Application Date: 2013-02-26
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Publication No.: US09281167B2Publication Date: 2016-03-08
- Inventor: Thanh X Nguyen , Rongjun Wang , Muhammad M Rasheed , Xianmin Tang
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agent Charles S. Guenzer
- Main IPC: C23C14/35
- IPC: C23C14/35 ; H01J37/34 ; H01J37/32 ; C23C14/56

Abstract:
A dual magnetron particularly useful for RF plasma sputtering includes a radially stationary open-loop magnetron comprising opposed magnetic poles and rotating about a central axis to scan an outer region of a sputter target and a radially movable open-loop magnetron comprising opposed magnetic poles and rotating together with the stationary magnetron. During processing, the movable magnetron is radially positioned in the outer region with an open end abutting an open end of the stationary magnetron to form a single open-loop magnetron. During cleaning, part of the movable magnetron is moved radially inwardly to scan and clean an inner region of the target not scanned by the stationary magnetron. The movable magnetron can be mounted on an arm pivoting about an axis at periphery of a rotating disk-shaped plate mounting the stationary magnetron so the arm centrifugally moves between radial positions dependent upon the rotation rate or direction.
Public/Granted literature
- US20140238843A1 Variable radius dual magnetron Public/Granted day:2014-08-28
Information query
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