Invention Grant
US09281255B2 Underfill composition and semiconductor device and manufacturing method thereof
有权
底部填充剂组合物和半导体器件及其制造方法
- Patent Title: Underfill composition and semiconductor device and manufacturing method thereof
- Patent Title (中): 底部填充剂组合物和半导体器件及其制造方法
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Application No.: US14435460Application Date: 2013-10-29
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Publication No.: US09281255B2Publication Date: 2016-03-08
- Inventor: Kohichiro Kawate
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- Agent Adam Bramwell
- Priority: JP2012-241063 20121031
- International Application: PCT/US2013/067173 WO 20131029
- International Announcement: WO2014/070694 WO 20140508
- Main IPC: H01L23/488
- IPC: H01L23/488 ; H01L23/29 ; H01L21/30 ; C08F2/46 ; H01L21/56 ; H01L25/00 ; H01L23/31 ; H01L23/00 ; H01L25/065 ; H01L21/78 ; C09K5/14 ; C08K3/22
Abstract:
To provide a solid preapplication underfill material that has excellent workability, has a high degree of freedom for solder bonding processes, and enables the formation of a solder bond with high reliability. (Resolution Means) The underfill composition of the present disclosure contains a hardened epoxy resin and has a viscosity of 1000 Pa·s or more at 30° C. The hardening epoxy resin includes a crystalline epoxy resin at not less than 50 wt % relative to an entire resin composition.
Public/Granted literature
- US20150332984A1 UNDERFILL COMPOSITION AND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-11-19
Information query
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