发明授权
- 专利标题： Multi-chip semiconductor device
- 专利标题（中）： 多芯片半导体器件
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申请号： US14031218申请日： 2013-09-19
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公开(公告)号： US09281294B2公开(公告)日： 2016-03-08
- 发明人: Masato Mikami , Takanori Sekido
- 申请人： OLYMPUS CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： OLYMPUS CORPORATION
- 当前专利权人： OLYMPUS CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Scully, Scott, Murphy & Presser, P.C.
- 优先权： JP2012-208586 20120921
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L25/00 ; H01L25/065
摘要：
A multi-chip semiconductor device includes a plate-shaped first semiconductor chip having a first connection portion in which a first semiconductor chip electrode is formed on a first main surface of the first semiconductor chip or on a first side surface vertical to the first main surface, and a plate-shaped second semiconductor chip having a second connection portion in which a second semiconductor chip electrode is formed on a second side surface vertical to a second main surface of the second semiconductor chip. Each of the first and second connection portions includes at least an inclined surface that is inclined with respect to each of the first and second main surfaces. The first connection portion and the second connection portion are connected to each other such that the first main surface of the first semiconductor chip and the second main surface of the second semiconductor chip are vertical to each other.
公开/授权文献
- US20140084488A1 MULTI-CHIP SEMICONDUCTOR DEVICE 公开/授权日：2014-03-27
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