Invention Grant
- Patent Title: Implantable device with shield integrated lead connector
- Patent Title (中): 带有屏蔽集成导线连接器的可植入设备
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Application No.: US14210901Application Date: 2014-03-14
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Publication No.: US09283396B2Publication Date: 2016-03-15
- Inventor: Darren A. Janzig
- Applicant: MEDTRONIC, INC.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agency: Mueting, Raasch & Gebhardt, P.A.
- Main IPC: A61N1/375
- IPC: A61N1/375

Abstract:
An implantable active medical device includes a hermetic housing defining an exterior surface and a hermetic cavity of an implantable active medical device. The hermetic housing has a first major surface, an opposing second major surface and a side surface extending between them. An elongate lead connector is recessed into the first major surface. The elongate lead connector has a top surface and a bottom surface and a side surface extending between them. The top surface forms only a portion of the first major surface.
Public/Granted literature
- US20140277218A1 IMPLANTABLE DEVICE WITH SHIELD INTEGRATED LEAD CONNECTOR Public/Granted day:2014-09-18
Information query
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