Invention Grant
- Patent Title: Support structure removal system
- Patent Title (中): 支撑结构拆除系统
-
Application No.: US13896404Application Date: 2013-05-17
-
Publication No.: US09283716B2Publication Date: 2016-03-15
- Inventor: William J. Swanson , Dominic F. Mannella , Ronald G. Schloesser
- Applicant: Stratasys, Inc.
- Applicant Address: US MN Eden Prairie
- Assignee: Statasys, Inc.
- Current Assignee: Statasys, Inc.
- Current Assignee Address: US MN Eden Prairie
- Agency: Westman, Champlin & Koehler, P.A.
- Main IPC: B08B3/00
- IPC: B08B3/00 ; B29C71/00 ; B08B3/10 ; B29C67/00

Abstract:
A three-dimensional printing farm comprising: a plurality of additive manufacturing systems each configured to print three- dimensional parts from part materials and associated support structures from support materials; a plurality of vessels configured to receive the printed three-dimensional parts and the associated support structures from the plurality of additive manufacturing systems; a support removal tank configured to retain an aqueous support removal fluid; one or more agitation mechanisms configured to agitate the aqueous support removal fluid in the support removal tank; a rinsing tank configured to retain an aqueous rinsing fluid; one or more robotic mechanisms; and a controller configured to direct the one or more robotic mechanisms.
Public/Granted literature
- US20130248491A1 Support Structure Removal System Public/Granted day:2013-09-26
Information query