Invention Grant
- Patent Title: Computer thermal management
- Patent Title (中): 电脑热管理
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Application No.: US14297582Application Date: 2014-06-05
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Publication No.: US09285846B2Publication Date: 2016-03-15
- Inventor: Brett W. Degner , Eric R. Prather , David H. Narajowski , Frank F. Liang , Jay S. Nigen , Jesse T. Dybenko , Connor R. Duke , Eugene A. Whang , Christopher J. Stringer , Joshua D. Banko , Caitlin Elizabeth Kalinowski , Jonathan L. Berk , Matthew P. Casebolt , Kevin S. Fetterman , Eric J. Weirshauser
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Downey Brand LLP
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20 ; G06F1/18 ; G08B5/36 ; G08B21/18 ; H05K5/03 ; F21V8/00 ; G06F3/00 ; H05K1/02

Abstract:
The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.
Public/Granted literature
- US20140362523A1 COMPUTER THERMAL MANAGEMENT Public/Granted day:2014-12-11
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