Invention Grant
US09288900B2 Printed circuit board, display device and method of manufacturing printed circuit board
有权
印刷电路板，显示装置及制造印刷电路板的方法
- Patent Title: Printed circuit board, display device and method of manufacturing printed circuit board
- Patent Title (中): 印刷电路板，显示装置及制造印刷电路板的方法
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Application No.: US14054308Application Date: 2013-10-15
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Publication No.: US09288900B2Publication Date: 2016-03-15
- Inventor: You Bean Kim , Seock-Hwan Kang , Jong Seo Lee
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: KR10-2013-0046297 20130425
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/46
Abstract:
A printed circuit board includes an insulation layer adjacent to a high-speed signal wire layer. A low-loss material layer is provided between the high-speed signal wire layer and the insulation layer. As a result, it is possible to reduce frequency loss of a high-speed signal wire layer and improve reliability of the printed circuit board.
Public/Granted literature
- US20140321071A1 PRINTED CIRCUIT BOARD, DISPLAY DEVICE AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD Public/Granted day:2014-10-30
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