Invention Grant
- Patent Title: Metal injection molded heat dissipation device
- Patent Title (中): 金属注塑散热装置
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Application No.: US14142821Application Date: 2013-12-28
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Publication No.: US09288933B2Publication Date: 2016-03-15
- Inventor: Gavin D. Stanley , Michael T. Crocker
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: International IP Law Group, P.L.L.C.
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H05K7/20 ; H01L23/373 ; H01L23/473 ; F28F13/00
Abstract:
A heat dissipation device is provided. The heat dissipation device includes an integrated heat spreader and a base plate coupled to the integrated heat spreader, wherein the base plate comprises a plurality of metal pellets to dissipate heat from the integrated heat spreader.
Public/Granted literature
- US20140111943A1 METAL INJECTION MOLDED HEAT DISSIPATION DEVICE Public/Granted day:2014-04-24
Information query
IPC分类:
