Invention Grant
- Patent Title: System and method for preparing, dispensing, and curing epoxy
- Patent Title (中): 制备，分配和固化环氧树脂的系统和方法
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Application No.: US13837000Application Date: 2013-03-15
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Publication No.: US09289920B2Publication Date: 2016-03-22
- Inventor: Keith Van Duinen , Miguel Rodriguez , Alejandro Leon
- Applicant: North American Interconnect LLC
- Applicant Address: US AZ Scottsdale
- Assignee: North American Interconnect LLC
- Current Assignee: North American Interconnect LLC
- Current Assignee Address: US AZ Scottsdale
- Agency: Benesch, Friedlander, Coplan & Aronoff LLP
- Main IPC: B05C11/10
- IPC: B05C11/10 ; B29C31/06 ; B29L11/00 ; B29C39/24 ; B29K63/00 ; G02B6/38 ; B29B13/00
Abstract:
A method for dispensing epoxy comprising the step of degassing an epoxy. The method further comprises the step of associating the epoxy with an epoxy injector comprising a dispensing end. The method further comprises the step of a computer receiving data representative of a selected container to receive the epoxy. The method further comprises the step of a computer determining a dispensing rate and a dispensing amount, based on the received data. The method further comprises the step of a computer causing the epoxy injector to dispense the determined dispensing amount of epoxy, via the dispensing end, at the determined dispensing rate. The method further comprises the step of a computer causing a dispensing arm, supporting the dispensing end, to retract the dispensing end while the epoxy injector is dispensing the epoxy. The method further comprises the step of curing the dispensed epoxy.
Public/Granted literature
- US20140263402A1 SYSTEM AND METHOD FOR PREPARING, DISPENSING, AND CURING EPOXY Public/Granted day:2014-09-18
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