Invention Grant
- Patent Title: Heating element for a printhead
- Patent Title (中): 用于打印头的加热元件
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Application No.: US14397720Application Date: 2012-10-31
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Publication No.: US09289987B2Publication Date: 2016-03-22
- Inventor: Galen P. Cook , Bradley D. Chung , Anthony M. Fuller
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: International IP Law Group, PLLC
- International Application: PCT/US2012/062700 WO 20121031
- International Announcement: WO2014/130002 WO 20140828
- Main IPC: B41J2/05
- IPC: B41J2/05 ; B41J2/14 ; B41J2/16 ; F22B1/28

Abstract:
An exemplary embodiment of the present invention provides for a fluid ejection device. The fluid ejection device includes a substrate, a conductive layer, a resistive layer, and at least one upper layer. The conductive layer is disposed on the substrate and an outer perimeter and an inner region thinner than the outer perimeter. The outer perimeter includes conductive elements spaced apart from one another. The resistive layer includes an outer resistive portion overlying the conductive elements and a central resistive portion lying on top of a raised bridge of the substrate, wherein the width of the raised bridge is substantially greater than the width of the central resistive portion. The at least one upper layer defines a boundary of a fluid chamber, and the boundary is aligned vertically above a border of the central resistive portion.
Public/Granted literature
- US20150266293A1 HEATING ELEMENT FOR A PRINTHEAD Public/Granted day:2015-09-24
Information query
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