Invention Grant
US09290377B2 Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device
有权
堆叠多个管芯以形成堆叠的半导体器件的方法和堆叠的半导体器件
- Patent Title: Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device
- Patent Title (中): 堆叠多个管芯以形成堆叠的半导体器件的方法和堆叠的半导体器件
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Application No.: US14554473Application Date: 2014-11-26
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Publication No.: US09290377B2Publication Date: 2016-03-22
- Inventor: Conrad Cachia , Kenneth Fonk
- Applicant: STMicroelectronics (Malta) Ltd
- Applicant Address: MT Kirkop
- Assignee: STMicroelectronics (Malta) Ltd
- Current Assignee: STMicroelectronics (Malta) Ltd
- Current Assignee Address: MT Kirkop
- Agency: Seed Intellectual Property Law Group PLLC
- Priority: ITTO2013A0967 20131128
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B81B7/00 ; B81C1/00 ; B81C3/00 ; H01L21/683 ; H01L25/065 ; H01L25/00 ; H01L23/00
Abstract:
A method of stacking a plurality of first dies to a respective plurality of second dies, each one of the first dies having a surface including a surface coupling region which is substantially flat, each one of the second dies having a respective surface including a respective surface coupling region which is substantially flat, the method comprising the steps of: forming, by means of a screen printing technique, an adhesive layer on the first dies at the respective surface coupling regions; and arranging the surface coupling region of each second die in direct physical contact with a respective adhesive layer of a respective first die among said plurality of first dies.
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