Invention Grant
- Patent Title: Method of manufacturing electronic device, electronic device, electronic apparatus, and moving object
- Patent Title (中): 电子设备，电子设备，电子设备和移动物体的制造方法
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Application No.: US14164807Application Date: 2014-01-27
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Publication No.: US09291457B2Publication Date: 2016-03-22
- Inventor: Shinya Aoki , Juichiro Matsuzawa , Osamu Kawauchi , Masaru Mikami
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2013-015206 20130130; JP2013-015207 20130130
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/10 ; G01C19/5783 ; H05K5/06
Abstract:
A method of manufacturing an electronic device in which an inner space for housing a gyro element is formed between a base and a lid and the base and the lid are bonded includes bonding the base and the lid in which a groove is provided on a surface to be bonded with the base so that the inner space communicates with the outside by not bonding the inner surface of the groove to the base and to position the groove around a concave portion provided on a side surface of the base, and closing a communication portion by irradiating a laser beam to the lid in the communication portion.
Public/Granted literature
- US20140211384A1 METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT Public/Granted day:2014-07-31
Information query
IPC分类:
