Invention Grant
- Patent Title: Splice cassettes and chips
- Patent Title (中): 拼接盒和芯片
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Application No.: US13901041Application Date: 2013-05-23
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Publication No.: US09291788B2Publication Date: 2016-03-22
- Inventor: Paula Rudenick , Scott C. Sievers , Raul Mario Saucedo , Gregory J. Schaible , Oscar Fernando Bran de Léon , Matthew Holmberg , Robert Szklarz , Patrick J. Thompson , Gustavo Cano
- Applicant: ADC Telecommunications, Inc.
- Applicant Address: US NC Hickory
- Assignee: COMMSCOPE TECHNOLOGIES LLC
- Current Assignee: COMMSCOPE TECHNOLOGIES LLC
- Current Assignee Address: US NC Hickory
- Agency: Merchant & Gould P.C.
- Main IPC: G02B6/44
- IPC: G02B6/44
Abstract:
A splice cassette includes a base and a cover. The base includes an outer channel and an inner storage region separated by a spool wall. The cover is configured to mount to the base to enclose the inner storage region. The outer channel extends radially outwardly from a perimeter of the cover. The cover includes guide spools and a chip receiving arrangement disposed on an inwardly-facing surface that faces the base when the cover mounts to the base. The splice chip remains on the cover when the cover is removed from the base.
Public/Granted literature
- US20130315549A1 SPLICE CASSETTES AND CHIPS Public/Granted day:2013-11-28
Information query
