Invention Grant
- Patent Title: Method of manufacturing a semiconductor package including a surface profile modifier
- Patent Title (中): 制造包括表面轮廓改性剂的半导体封装的方法
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Application No.: US14577490Application Date: 2014-12-19
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Publication No.: US09293389B2Publication Date: 2016-03-22
- Inventor: Kyol Park , Yun-Hyeok Im
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2012-0148218 20121218
- Main IPC: H01L23/22
- IPC: H01L23/22 ; H01L23/367 ; H01L25/065 ; H01L25/10 ; H01L21/56 ; H01L23/00 ; H05K3/30 ; H05K1/02 ; H05K3/28
Abstract:
A semiconductor package includes a circuit board having an inner circuit pattern and a plurality of contact pads connected to the inner circuit pattern, at least one integrated circuit (IC) device on the circuit board and making contact with the contact pads, a mold on the circuit board, the mold fixing the IC device to the circuit board, and a surface profile modifier on a surface of the IC device and a surface of the mold, and the surface profile modifier enlarging a surface area of the IC device and the mold to dissipate heat.
Public/Granted literature
- US20150104905A1 METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE Public/Granted day:2015-04-16
Information query
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