Invention Grant
- Patent Title: Chip package and method for forming the same
- Patent Title (中): 芯片封装及其形成方法
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Application No.: US14260205Application Date: 2014-04-23
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Publication No.: US09293394B2Publication Date: 2016-03-22
- Inventor: Bai-Yao Lou , Tsang-Yu Liu , Chia-Sheng Lin , Tzu-Hsiang Hung
- Applicant: XINTEC INC.
- Applicant Address: TW Taoyuan
- Assignee: XINTEC INC.
- Current Assignee: XINTEC INC.
- Current Assignee Address: TW Taoyuan
- Agency: Liu & Liu
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/48 ; H01L23/498 ; H01L23/04 ; H01L23/31 ; H01L21/768
Abstract:
An embodiment of the invention provides a chip package which includes a substrate having a first surface and a second surface; a conducting pad structure located on the first surface; a dielectric layer located on the first surface of the substrate and the conducting pad structure, wherein the dielectric layer has an opening exposing a portion of the conducting pad structure; and a cap layer located on the dielectric layer and filled into the opening.
Public/Granted literature
- US20140231966A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME Public/Granted day:2014-08-21
Information query
IPC分类:
