发明授权
- 专利标题： Electronic device having a molding compound including a composite material
- 专利标题（中）： 具有包含复合材料的模塑料的电子装置
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申请号： US12792129申请日： 2010-06-02
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公开(公告)号： US09293420B2公开(公告)日： 2016-03-22
- 发明人: Adam D. Fogle , David S. Lehtonen , Richard Clark Blish, II
- 申请人： Adam D. Fogle , David S. Lehtonen , Richard Clark Blish, II
- 申请人地址： US CA San Jose
- 专利权人： Cypress Semiconductor Corporation
- 当前专利权人： Cypress Semiconductor Corporation
- 当前专利权人地址： US CA San Jose
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; H01L23/552 ; H01L23/29 ; H01L23/544 ; H01L23/00 ; H01L27/115
摘要：
An electronic device includes a packaged integrated circuit having an integrated circuit die having an active surface, and a molding compound overlaying the active surface of the integrated circuit die. In a particular embodiment, the packaged integrated circuit includes at least approximately five weight percent (5 wt %) zinc relative to the molding compound. In another embodiment, the packaged integrated circuit includes approximately 0.3 μmol/cm2 of zinc in an area parallel to the active surface of the integrated circuit die.
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