发明授权
- 专利标题： Semiconductor device with seal ring with embedded decoupling capacitor
- 专利标题（中）： 带封装环的半导体器件带有去耦电容
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申请号： US13296410申请日： 2011-11-15
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公开(公告)号： US09293606B2公开(公告)日： 2016-03-22
- 发明人: Kuo-Ji Chen , Wei Yu Ma , Ta-Pen Guo , Hsien-Wei Chen , Hao-Yi Tsai
- 申请人： Kuo-Ji Chen , Wei Yu Ma , Ta-Pen Guo , Hsien-Wei Chen , Hao-Yi Tsai
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Duane Morris LLP
- 主分类号： H01L29/93
- IPC分类号： H01L29/93 ; H01L29/94 ; H01L23/522 ; H01L23/528 ; H01L23/58 ; H01L27/06 ; H01L27/08 ; H01L49/02
摘要：
A seal ring for semiconductor devices is provided with embedded decoupling capacitors. The seal ring peripherally surrounds an integrated circuit chip in a seal ring area. The at least one embedded decoupling capacitor may include MOS capacitors, varactors, MOM capacitors and interdigitized capacitors with multiple capacitor plates coupled together. The opposed capacitor plates are coupled to different potentials and may advantageously be coupled to Vdd and Vss.
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