发明授权
- 专利标题： Methods for electroless plating of a solar cell metallization layer
- 专利标题（中）： 太阳能电池金属化层的无电镀方法
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申请号： US14097164申请日： 2013-12-04
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公开(公告)号： US09293624B2公开(公告)日： 2016-03-22
- 发明人: Michael Cudzinovic , Joseph Behnke
- 申请人： SunPower Corporation
- 申请人地址： US CA San Jose
- 专利权人： SunPower Corporation
- 当前专利权人： SunPower Corporation
- 当前专利权人地址： US CA San Jose
- 代理机构： Blakely Sokoloff Taylor Zafman LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L31/068 ; C25D5/10 ; C23C18/16 ; C25D7/12 ; H01L31/0224 ; H01L31/0745
摘要：
A method for forming a contact region for a solar cell is disclosed. The method includes depositing a paste composed of a first metal above a substrate of the solar cell, curing the paste to form a first metal layer, electrolessly plating a second metal layer on the first metal layer and electrolytically plating a third metal layer on the second metal layer, where the second metal layer electrically couples the first metal layer to the third metal layer. The method can further include electrolytically plating a fourth metal layer on the third metal layer.
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