Invention Grant
- Patent Title: Solid-state image pickup device, method of manufacturing the same, and electronic apparatus
- Patent Title (中): 固体摄像装置及其制造方法以及电子设备
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Application No.: US14395401Application Date: 2013-04-17
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Publication No.: US09293722B2Publication Date: 2016-03-22
- Inventor: Yuki Miyanami
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2012-104521 20120501
- International Application: PCT/JP2013/061363 WO 20130417
- International Announcement: WO2013/164948 WO 20131107
- Main IPC: H01L51/44
- IPC: H01L51/44 ; H01L27/30
Abstract:
A solid-state image pickup device includes: an organic photoelectric conversion layer; a passivation layer formed to cover a top of the organic photoelectric conversion layer; and an insulating film formed on the passivation layer and in a slit produced on a level difference in the passivation layer, the insulating film having a smaller refractive index than that of the passivation layer.
Public/Granted literature
- US20150115243A1 SOLID-STATE IMAGE PICKUP DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS Public/Granted day:2015-04-30
Information query
IPC分类:
