Invention Grant
- Patent Title: Grounding conductor
- Patent Title (中): 接地导体
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Application No.: US13967569Application Date: 2013-08-15
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Publication No.: US09293842B2Publication Date: 2016-03-22
- Inventor: David Michael Lettkeman
- Applicant: DISH Network L.L.C.
- Applicant Address: US CO Englewood
- Assignee: DISH NETWORK L.L.C.
- Current Assignee: DISH NETWORK L.L.C.
- Current Assignee Address: US CO Englewood
- Agency: Dorsey & Whitney LLP
- Main IPC: H01R4/64
- IPC: H01R4/64 ; H01R24/30

Abstract:
An electrical device and/or a connected component is grounded utilizing a dedicated listed grounding conductor that permanently connects to a chassis of the electrical device and a grounded receptacle. The grounding conductor is dedicated to and listed for grounding the electrical device and/or connected components. The grounding conductor includes a first portion that is permanently connectible to a chassis of the electrical device, a second portion that is permanently connectible to the grounding receptacle, and a conductor portion that connects the first portion and second portion. In some implementations, the first portion may include a terminal lug that connects to a port of the chassis and may be secured by a nut that may require mechanical assistance to remove. In various implementations, the second portion may include a ring that is operable to receive a screw that mates with a screw hole of the grounding receptacle.
Public/Granted literature
- US20150047869A1 Grounding Conductor Public/Granted day:2015-02-19
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